Advanced Search Results
Refine your search by using the category filter.
High-purity coarse spherical copper powder with controlled particle size.
High-purity, high-density spherical copper powder for enhanced conductivity and versatility.
Compound Bar, Bimetal
The Compound Bar, Bimetal, is a laboratory equipment used to demonstrate unequal expansion in different materials on heating, highlighting the role of temperature and materials in practical applications such as thermostats. This device features a unique design, consisting of two metal strips, each 28cm (11 inches) in length, attached to a wooden handle, resulting in a total length of 39cm (15 inches) and weighing 138g. It is commonly used in physics and engineering classes to help students understand the principles of thermal expansion and its applications in various industries.
Product Specifications
| Product Name | Compound Bar, Bimetal |
| Material | Bimetal, Wooden Handle |
| Function | Demonstrate Unequal Expansion in Different Materials on Heating |
| Application | Thermostats, Thermal Expansion, Physics, and Engineering Education |
| Dimensions | 28cm (11 inches) metal strips, 39cm (15 inches) total length, 2x1x16 inches (previous version) |
| Weight | 138g |
| SKU | LC674 |
Applications and Benefits
- for science teachers, students studying thermodynamics or materials science, engineering students, and professionals in the HVAC or thermostat industry
- for demonstrating thermal expansion and its applications in various industries, such as manufacturing and construction
- Helps students understand the principles of thermal expansion and its importance in physics and engineering, with a unique hands-on experience
Key Features and Benefits
- Made of Bimetal, a unique material that demonstrates unequal expansion in different materials on heating, with a wooden handle for easy handling
- Compact design, with dimensions of 28cm (11 inches) metal strips and a total length of 39cm (15 inches), weighing 138g
- for laboratory equipment, physics demonstrations, and engineering education, providing a understanding of thermal expansion
Claisen Type Connecting Tubes
Claisen Type Connecting Tubes are essential components in any laboratory setting. These tubes are designed to connect various pieces of laboratory equipment, allowing for seamless experimentation and testing. The Claisen Type design ensures a secure and tight fit, preventing any leaks or spills. These tubes are made from high-quality materials, ensuring durability and longevity. Whether you're a student or a professional, Claisen Type Connecting Tubes are a must-have for any laboratory.
Product Specifications:
| Product Name: | Connecting Tubes |
| Type: | Claisen Type Tubes |
| Usage: | Connecting |
| Compatibility: | Claisen Connecting Tubes |
| Material: | Claisen Type Connecting Tubes |
| Size: | Claisen Type Connecting Tubes |
| Color: | Claisen Type |
Perfect For:
- Chemistry students and professionals
- Laboratory technicians and researchers
- Science educators and instructors
- Chemical manufacturers and suppliers
- Pharmaceutical companies and researchers
- Biotech companies and researchers
Copper Electrode, Flat, Copper Anode, One Piece
This flat copper anode electrode offers 99.9% pure copper in a compact 19 mm × 125 mm (3/4 × 5 in) format. Stamped with “Cu” for clear identification, the one‑piece construction provides consistent electrical conductivity for a wide range of laboratory experiments. Each unit is individually packaged for convenience and protection.
Product Specifications
| Material | Copper (Cu) |
| Purity | 99.9% |
| Shape | Flat – 19mm x 125mm (3/4 x 5 inches) |
| Identification | Stamped "Cu" |
| Weight | 18g |
| Electrical Conductivity | High (consistent with 99.9% pure copper) |
| Model/Part Number | CUFLAT |
| Packaging | Individual |
Applications and Benefits:
- Science experiments and educational demonstrations
- Physics and chemistry laboratory procedures
- Electrochemical cell anodes
- Metal conductivity testing
Key Features and Benefits
- 99.9% pure copper for conductivity
- Flat form factor (19mm × 125mm) for easy handling
- Stamped “Cu” for clear material identification
- One‑piece construction eliminates seams and joints
- High electrical conductivity suitable for precise measurements
- Durable metal suitable for repeated experimental use
- Individual packaging for convenience and protection
- Weight: 18g
Caution:
Metal electrodes have sharp edges; handle with care to avoid injury.
Copper Granules, 16 Mesh (Coarse Copper Powder)
Coarse copper powder composed of high-purity metallic copper. Particles are solid, nearly uniform in size, and feature the appearance of metallic spherical crystals. Recommended for wood inlay, art projects, and industrial applications where solid round multi-sided balls are suitable. In laboratory settings, granular copper is utilized for sulfur removal from environmental samples. CAS No.: 7440-50-8.
Product Specifications
| Mesh Size | 16 |
| Material | High-purity Copper |
| Particle Shape | Spherical, metallic crystals |
| CAS Number | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial processes
- Laboratory sulfur removal from environmental samples
Caution:
Store in a dry and cool environment to maintain material integrity. Handle with appropriate protective measures to avoid direct contact. Ensure compatibility with intended applications before use.
Copper Granules, 35 Mesh (Coarse Copper Powder)
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples. Coarse 35 mesh size, with granules approximately 0.5 mm in diameter.
Product Specifications
| Mesh Size | 35 mesh |
| Granule Diameter | Approximately 0.5 mm |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Granules, Mesh 20 (Coarse Copper Powder)
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples.
Product Specifications
| Copper | 99.84% |
| Apparent Density | 5.29 g/cc |
| Sieve Analysis (Typical) | +20 mesh: 0% -20/+30 mesh: 100% -30/+40 mesh: 0.0% -40 mesh: 0.0% |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Granules, Mesh 20 (Coarse Copper Powder)
Coarse copper powder made of solid metallic copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples.
Product Specifications
| Copper | 98% |
| Apparent Density | 5.29 g/cc |
| Sieve Analysis (Typical) | +20 mesh: 0% -20/+30 mesh: 100% -30/+40 mesh: 0.0% -40 mesh: 0.0% |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Spherical Copper Powder - 100 Mesh - 99.5% Cu
High-purity spherical copper powder consisting predominantly of spherical copper particles with a bright reddish-copper appearance. The 100 mesh grade is coarse relative to fine and ultra-fine copper powders. Because the particles are rounded and smooth, the powder flows freely, packs to a high tap density, and behaves consistently during die filling and dosing.
Calibrated microscopy of the current material shows that the mass is carried primarily by coarse spheres near the top of the 100 mesh cut, together with a population of smaller particles that contributes relatively little to the overall mass. This produces the characteristic appearance of larger spheres surrounded by finer particles. Practically all of the material passes through mesh 100 sieve, corresponding to an opening of approximately 150 microns, and the typical mass-median particle size is approximately 120 microns.
The coarse spherical morphology provides a lower specific surface area than fine or ultra-fine copper powder, contributing to improved storage stability and slower development of surface oxidation. Copper powder may exhibit limited electrical continuity when tested as loose powder because individual particles are not necessarily in continuous contact. Conductivity can increase substantially after compaction or when the powder is incorporated into a suitable resin, oil, polymer, or other matrix.
Product Specifications
| Product | Spherical Copper Powder |
| Assay | 99.5% Copper minimum |
| Current Lot Analysis | 99.95% Copper |
| Mesh Grade | 100 Mesh |
| 100 Mesh Sieve Opening | Approximately 150 microns |
| Typical Mass Median (Dv50) | Approximately 120 microns, based on image analysis |
| Particle Morphology | Predominantly spherical to near-spherical |
| Appearance | Reddish-copper metallic powder |
| Chemical Symbol | Cu |
| CAS Number | 7440-50-8 |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
Typical Particle Size Distribution
The values below are typical mass-based results obtained from calibrated optical image analysis of the current material. Percentages are cumulative and represent the share of total mass finer than each listed sieve opening. These values are provided as general guidance for particle-size selection and may vary from lot to lot.
| Sieve | Opening | Typical Cumulative % Passing by Mass |
| 100 Mesh | 150 microns | About 99% |
| 120 Mesh | 125 microns | About 64% |
| 140 Mesh | 106 microns | About 23% |
| 170 Mesh | 90 microns | About 12% |
| 200 Mesh | 75 microns | About 5% |
| 325 Mesh | 45 microns | About 1% |
Typical percentile sizes by mass are approximately Dv10 near 85 microns, Dv50 near 120 microns, and Dv90 near 135 microns. Most of the mass falls between approximately 105 and 150 microns, resulting in a coarse, relatively narrow particle-size distribution immediately below the 100 mesh opening. A finer particle population is present by particle count but contributes relatively little to total mass. These figures are derived from image analysis and are not a certified sieve analysis.
Particle Characteristics
- Predominantly spherical and near-spherical copper particles with smooth metallic surfaces.
- Free-flowing morphology supports even die filling and consistent dosing.
- Good packing characteristics and high tap density associated with spherical morphology.
- High metallic copper content of 99.5% minimum supports electrical and thermal conductivity after compaction or incorporation into a suitable matrix.
- Lower specific surface area than fine or ultrafine copper provides improved storage stability and slower surface oxidation.
- Coarse spherical particles carry most of the material mass, with a finer population present primarily by particle count.
- Material mass is concentrated near the upper end of the 100 mesh cut, with essentially all material passing 100 mesh.
- Bright reddish-copper metallic appearance.
- Suitable for formulations requiring metallic copper with a relatively coarse, controlled particle size.
Applications and Benefits:
- Powder metallurgy and press-and-sinter components.
- Sintered porous parts, including filters and self-lubricating bearings, where spherical morphology can provide controlled, interconnected porosity.
- Metal-filled polymers, resins, and epoxies.
- Thermally conductive compounds and gap fillers.
- Bulk metallic filler in compounded conductive pastes, adhesives, and sealants. This is a coarse-particle filler rather than a fine-line printing ink powder.
- Cold casting and metal-filled resin castings that can be sanded and polished to produce a metallic copper surface.
- Decorative metallic epoxy, resin, and coating finishes requiring a visible copper effect.
- Metal-bonded matrix and friction formulations using copper as a matrix metal.
- Copper-based brazing and joining formulations.
- Copper metal reagent for laboratory and research chemistry.
- Educational demonstrations involving metallic powders.
- High-density and specialty industrial filler applications.
Caution:
Fine metal powders should be handled carefully to minimize airborne dust. Avoid inhalation, unnecessary dust generation, and contact with incompatible materials or ignition sources. Refer to the current SDS for complete handling, storage, personal protection, and disposal information.
Copper Powder 99+%, Mesh 200
High-purity copper powder made via water atomization and hydrogen reduction. Features very fine, irregular particles and clusters with relatively lower density. Recommended for applications requiring high purity and conductivity, including diamond wheels, sintering, and chemical reactions. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.3% |
| Hydrogen Loss | 0.39% |
| Apparent Density | 2.6 - 2.8 g/cc |
| Mesh Size | 200 mesh |
| Sieve Analysis |
+100 Mesh: Trace +140 Mesh: 1% Max +200 Mesh: 3% Max +325 Mesh: Balance -325 Mesh: 90% Min |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
- Diamond wheels
- Chemical reactions
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.3%, General Purpose, 150 Mesh
The most popular and widely used copper powder, produced by the water atomization method followed by hydrogen reduction. This general-purpose copper powder has diverse applications, including the production of copper compounds, use as a catalyst in chemical formulations, abrasive wheels, carbon brushes, and more. It is important to note that pure copper powders may not exhibit continuity or conductivity under low-voltage multimeter tests due to air gaps and weak particle contacts but will show conductivity under higher voltage, when compacted, or mixed with oils/resins to form a paste.
Product Specifications
| Purity | 99.3% |
| Apparent Density | 2.7 g/cc |
| Nominal Mesh | -140 |
| -325 Mesh Ratio | > 50% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Production of copper compounds
- Catalyst in chemical formulations
- Abrasive wheels
- Carbon brushes
- Electronics and electrical applications
- Decorative and protective coatings
- Brazing and general-purpose industrial use
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.3%, Mesh 325
Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.31% |
| Hydrogen Loss | 0.39% |
| Apparent Density | 2.97 g/cc |
| Mesh Size | 325 mesh |
| Sieve Analysis |
+60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.5% - 99.9%
Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.81% |
| Iron | 0.01% |
| Hydrogen Loss | 0.18% |
| Apparent Density | 4.89 g/cc |
| Sieve Analysis | +200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Dark Copper Powder 99.5% - 99.9%
Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.81% |
| Iron | 0.01% |
| Hydrogen Loss | 0.18% |
| Apparent Density | 4.89 g/cc |
| Sieve Analysis | +200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.8%, Electronic Grade, Mesh 325
Electronic grade, high-purity copper powder made via water atomization and hydrogen reduction. Features ultra-fine, spheroidal particles with high conductivity and low density. Recommended for a variety of applications where conductivity is crucial, including thick and thin film pastes, capacitor chips, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.85% |
| Hydrogen Loss | 0.19% |
| Apparent Density | 2.97 g/cc |
| Mesh Size | 325 mesh |
| Sieve Analysis | +60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder > 99% (150 - 325 Mesh)
General-purpose, highly pure (>99%) copper powder made from electrolytic copper. Granular copper with a mesh size of 150 - 325. Known for its excellent electrical and thermal conductivities, this product finds use in the electrical and electronic industries. Additional applications include self-lubricating bearings, brazing, cold soldering, and mechanical plating. It is also used for antifouling paints, decorative and protective coatings, printing inks, medals, medallions, metal-plastic decorative products, and various chemical and medical purposes.
Product Specifications
| Purity | >99% |
| Mesh Size | 150 - 325 |
| Screen Analysis |
+60: 0.0% -60/+100: 0.7% -100/+200: 89.7% -200/+325: 9.1% -325: 0.5% |
Applications and Benefits:
- Electrical and electronic applications
- Self-lubricating bearings
- Brazing and cold soldering
- Mechanical plating
- Antifouling paints and decorative coatings
- Printing inks
- Medals, medallions, and metal-plastic decorative products
- Chemical and medical purposes
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
CU264: Copper Powder, 99.5%, Mesh 100
High purity copper powder, nominal mesh 100, Apparent density: 2.6 g/cc, Copper > 99.5%, with irregular shape particles. Used in powder metallurgy. May be admixed with other metal powders and graphite for specific properties such as strength, hardness and wear resistance for structural parts.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features
- High Purity Copper (>99.5%)
- Nominal Mesh 100 for fine granularity
- Irregular particle shape for diverse uses
- Compatible with other metals and graphite
- Conductivity with higher voltage or when compacted
Product Specifications
| Apparent Density | 2.6 g/cc |
| Purity | > 99.5% Copper |
| Particle Shape | Irregular |
| Conductivity | At higher voltages/when compacted |
| Applications | Powder Metallurgy, Alloys |
Similar Products
- High purity bronze powder, metallurgy
- Fine granular aluminum powder, industrial
- Nickel powder, high density, 99% purity
- Spherical zinc powder, corrosion-resistant
- Iron powder, magnetic, for alloys
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Metallurgists, Industrial Manufacturers, Material Scientists, Engineering Students, Research and Development Labs
For MSDS Go to Downloads TabCU118SP Copper Powder, Fine, Spherical
Our specification guarantees that at least 80% of this powder are particles smaller than 44 micron. A typical analysis however shows that 88% of particles are smaller than 44 micron. Most particles are between 16 micron and 28 micron.
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features:
- High-purity, high-density spherical copper powder
- Provides high heat conductivity and electrical conductivity
- Suitable for various applications, including cold casting, 3-D printer filaments, metal clay, sintering, green/blue patina and rust effect, preventing mold in concrete, plaster, dry-wall, paint, adhesives, and grout
- Used in the 3D printing process known as Selective Powder Deposition (SPD)
- Particle size distribution with 88% of particles smaller than 44 micron
Product Specifications:
| Copper Purity | Over 99.5% |
| Hydrogen Loss | Less than 0.7% |
| Apparent Density | 4.5-5.5 g/cc |
| Typical Analysis | Copper > 99.5% Hydrogen Loss < 0.7% Apparent Density, g/cc: 4.5 - 5.5 Passing mesh 325 (44 micron): 80% ~ 88% |
Similar Products:
- Ultra-Fine Copper Powder
- High-Purity Copper Foil
- Copper Wire
- Copper Rod
- Copper Sheet
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for enhanced conductivity and versatility applications, including cold casting, 3-D printing, metal clay, and more.
For MSDS ClickCU7005F Copper Powder
Copper Powder offers exceptional metallic shine, ideal for metallic inks and paints. Compatible with most resins and conductive for ink creation.
For more details, visit the CU7005F product data sheet.
Key Features
- Exceptional metallic shine
- Art-grade pigment quality
- Compatible with various resins
- Usable with drying oils like linseed
- Enables creation of conductive inks
Product Specifications
| Type | Copper Powder |
| Use | Metallic Inks, Paints |
| Compatibility | Polyurethane, Polyacrylic, Polyester |
| Conductivity | Suitable for Conductive Inks |
| Pigment Quality | Art Grade |
Similar Products
- Metallic-shine gold powder for inks
- Silver pigment powder, art-grade
- Bronze powder, resin-compatible
- Reflective aluminum powder, versatile
- Artistic brass powder for painting
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Artists, Paint Manufacturers, and DIY Craft Enthusiasts
Copper Powder CU112SP
CU112SP is a super fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products.
Our specification guarantees that at least 95% of this powder are particles smaller than 44 micron. A typical analysis however shows that 99.9% of particles are smaller than 44 micron. Most particles are between 10 micron and 22 micron.
HTS Code: 7406.10.0000.
NMFC: 30743
CAS: 7440-50-8
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Old product code: CU155A
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features
- Super fine, spherical particles
- High density and purity
- Excellent thermal and electrical conductivity
- Consistent particle size distribution
- Versatile applications in industry and art
Product Specifications
| Particle Size | 95% < 44 microns |
| Purity | > 99.2% Copper |
| Apparent Density | 4.5 - 5.5 g/cc |
| Hydrogen Loss | < 0.7% |
| Mesh Passing | 99.9% through 325 (44 micron) |
Similar Products
- Fine silver powder, high conductivity
- Spherical bronze powder, 3D printing
- Fine aluminum powder, thermal conductivity
- High-purity zinc powder, corrosion resistance
- Spherical titanium powder, lightweight strength
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for 3D Printing Enthusiasts, Industrial Manufacturers, Electronics Professionals, Artists and Sculptors, Construction Material Suppliers
For MSDS Click or Go to Downloads TabHighly pure (>99%) electrolytic copper in a granular form, Copper Filings are versatile for various industrial, chemical, and artistic applications. Mesh 25 - 325 suitable for electrical and thermal conductivities.
Key Features
- Highly pure electrolytic copper
- Excellent electrical and thermal conductivities
- Versatile mesh size from 25 - 325
- Useful in a wide range of applications
- Effective for coatings, brazing, and soldering
Product Specifications
| Material | Copper >99% Purity |
| Mesh Size | 25 - 325 |
| Form | Granular Mixed Grain |
| Applications | Electrical, Mechanical, Decorative |
Similar Products
- High conductivity copper mesh
- Electrical grade copper pellets
- Thermal conductive copper strips
- Fine copper powder for coating
- Brazing grade copper granules
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Electrical Engineers, Industrial Manufacturers, Artists and Craftsmen, Chemical Technicians, Medical Equipment Manufacturers