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High-purity coarse spherical copper powder with controlled particle size.
High-purity, high-density spherical copper powder for enhanced conductivity and versatility.
High-density spherical bronze for specialized industrial applications.
Spherical Copper Powder - 100 Mesh - 99.5% Cu
High-purity spherical copper powder consisting predominantly of spherical copper particles with a bright reddish-copper appearance. The 100 mesh grade is coarse relative to fine and ultra-fine copper powders. Because the particles are rounded and smooth, the powder flows freely, packs to a high tap density, and behaves consistently during die filling and dosing.
Calibrated microscopy of the current material shows that the mass is carried primarily by coarse spheres near the top of the 100 mesh cut, together with a population of smaller particles that contributes relatively little to the overall mass. This produces the characteristic appearance of larger spheres surrounded by finer particles. Practically all of the material passes through mesh 100 sieve, corresponding to an opening of approximately 150 microns, and the typical mass-median particle size is approximately 120 microns.
The coarse spherical morphology provides a lower specific surface area than fine or ultra-fine copper powder, contributing to improved storage stability and slower development of surface oxidation. Copper powder may exhibit limited electrical continuity when tested as loose powder because individual particles are not necessarily in continuous contact. Conductivity can increase substantially after compaction or when the powder is incorporated into a suitable resin, oil, polymer, or other matrix.
Product Specifications
| Product | Spherical Copper Powder |
| Assay | 99.5% Copper minimum |
| Current Lot Analysis | 99.95% Copper |
| Mesh Grade | 100 Mesh |
| 100 Mesh Sieve Opening | Approximately 150 microns |
| Typical Mass Median (Dv50) | Approximately 120 microns, based on image analysis |
| Particle Morphology | Predominantly spherical to near-spherical |
| Appearance | Reddish-copper metallic powder |
| Chemical Symbol | Cu |
| CAS Number | 7440-50-8 |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
Typical Particle Size Distribution
The values below are typical mass-based results obtained from calibrated optical image analysis of the current material. Percentages are cumulative and represent the share of total mass finer than each listed sieve opening. These values are provided as general guidance for particle-size selection and may vary from lot to lot.
| Sieve | Opening | Typical Cumulative % Passing by Mass |
| 100 Mesh | 150 microns | About 99% |
| 120 Mesh | 125 microns | About 64% |
| 140 Mesh | 106 microns | About 23% |
| 170 Mesh | 90 microns | About 12% |
| 200 Mesh | 75 microns | About 5% |
| 325 Mesh | 45 microns | About 1% |
Typical percentile sizes by mass are approximately Dv10 near 85 microns, Dv50 near 120 microns, and Dv90 near 135 microns. Most of the mass falls between approximately 105 and 150 microns, resulting in a coarse, relatively narrow particle-size distribution immediately below the 100 mesh opening. A finer particle population is present by particle count but contributes relatively little to total mass. These figures are derived from image analysis and are not a certified sieve analysis.
Particle Characteristics
- Predominantly spherical and near-spherical copper particles with smooth metallic surfaces.
- Free-flowing morphology supports even die filling and consistent dosing.
- Good packing characteristics and high tap density associated with spherical morphology.
- High metallic copper content of 99.5% minimum supports electrical and thermal conductivity after compaction or incorporation into a suitable matrix.
- Lower specific surface area than fine or ultrafine copper provides improved storage stability and slower surface oxidation.
- Coarse spherical particles carry most of the material mass, with a finer population present primarily by particle count.
- Material mass is concentrated near the upper end of the 100 mesh cut, with essentially all material passing 100 mesh.
- Bright reddish-copper metallic appearance.
- Suitable for formulations requiring metallic copper with a relatively coarse, controlled particle size.
Applications and Benefits:
- Powder metallurgy and press-and-sinter components.
- Sintered porous parts, including filters and self-lubricating bearings, where spherical morphology can provide controlled, interconnected porosity.
- Metal-filled polymers, resins, and epoxies.
- Thermally conductive compounds and gap fillers.
- Bulk metallic filler in compounded conductive pastes, adhesives, and sealants. This is a coarse-particle filler rather than a fine-line printing ink powder.
- Cold casting and metal-filled resin castings that can be sanded and polished to produce a metallic copper surface.
- Decorative metallic epoxy, resin, and coating finishes requiring a visible copper effect.
- Metal-bonded matrix and friction formulations using copper as a matrix metal.
- Copper-based brazing and joining formulations.
- Copper metal reagent for laboratory and research chemistry.
- Educational demonstrations involving metallic powders.
- High-density and specialty industrial filler applications.
Caution:
Fine metal powders should be handled carefully to minimize airborne dust. Avoid inhalation, unnecessary dust generation, and contact with incompatible materials or ignition sources. Refer to the current SDS for complete handling, storage, personal protection, and disposal information.
For MSDS Go to Downloads TabCU118SP Copper Powder, Fine, Spherical
Our specification guarantees that at least 80% of this powder are particles smaller than 44 micron. A typical analysis however shows that 88% of particles are smaller than 44 micron. Most particles are between 16 micron and 28 micron.
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features:
- High-purity, high-density spherical copper powder
- Provides high heat conductivity and electrical conductivity
- Suitable for various applications, including cold casting, 3-D printer filaments, metal clay, sintering, green/blue patina and rust effect, preventing mold in concrete, plaster, dry-wall, paint, adhesives, and grout
- Used in the 3D printing process known as Selective Powder Deposition (SPD)
- Particle size distribution with 88% of particles smaller than 44 micron
Product Specifications:
| Copper Purity | Over 99.5% |
| Hydrogen Loss | Less than 0.7% |
| Apparent Density | 4.5-5.5 g/cc |
| Typical Analysis | Copper > 99.5% Hydrogen Loss < 0.7% Apparent Density, g/cc: 4.5 - 5.5 Passing mesh 325 (44 micron): 80% ~ 88% |
Similar Products:
- Ultra-Fine Copper Powder
- High-Purity Copper Foil
- Copper Wire
- Copper Rod
- Copper Sheet
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for enhanced conductivity and versatility applications, including cold casting, 3-D printing, metal clay, and more.
Copper Powder CU112SP
CU112SP is a super fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products.
Our specification guarantees that at least 95% of this powder are particles smaller than 44 micron. A typical analysis however shows that 99.9% of particles are smaller than 44 micron. Most particles are between 10 micron and 22 micron.
HTS Code: 7406.10.0000.
NMFC: 30743
CAS: 7440-50-8
Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Old product code: CU155A
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features
- Super fine, spherical particles
- High density and purity
- Excellent thermal and electrical conductivity
- Consistent particle size distribution
- Versatile applications in industry and art
Product Specifications
| Particle Size | 95% < 44 microns |
| Purity | > 99.2% Copper |
| Apparent Density | 4.5 - 5.5 g/cc |
| Hydrogen Loss | < 0.7% |
| Mesh Passing | 99.9% through 325 (44 micron) |
Similar Products
- Fine silver powder, high conductivity
- Spherical bronze powder, 3D printing
- Fine aluminum powder, thermal conductivity
- High-purity zinc powder, corrosion resistance
- Spherical titanium powder, lightweight strength
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for 3D Printing Enthusiasts, Industrial Manufacturers, Electronics Professionals, Artists and Sculptors, Construction Material Suppliers
Steel Powder, Iron Powder, 250 Micron
Coarse steel powder (S100N) is produced from recycled black steel (construction steel) with improved features like dust-free, equal-size, and mostly spherical particles. It demonstrates strong magnetic attraction, has a high flow rate for dispensing from shakers, and is free from organic impurities such as cutting oil. This product is ideal for educational and industrial applications, including magnetism experiments, rust effect creation, and as a plant nutrient for iron supplementation.
Specifications
| Product Type | Recycled Black Steel (Construction Steel) |
| Particle Size | 250 Micron |
| Special Features | Dust-free, Spherical Particles, High Flow Rate |
| Magnetic Properties | Strong Magnetic Attraction |
| Organic Impurities | None |
| Carbon (C) | 0.8% - 1.2% |
| Manganese (Mn) | 0.35% - 1.2% |
| Silicon (Si) | 0.4% Minimum |
| Sulfur (S) | 0.05% Maximum |
| Phosphorus (P) | 0.05% Maximum |
Applications and Benefits:
- Used as iron filings for magnetism and electromagnetism experiments
- Preferred for educational use due to cleanliness and contamination-free particles
- Creates rust effects in sculptures, concrete, and structures
- Serves as a plant nutrient for iron supplementation
- High flow rate makes it suitable for dispensing from shakers
Caution:
This product may rust over time due to its recycled steel composition. Handle with care and review the Material Safety Data Sheet (MSDS) for safety precautions.
Activated Carbon Powder
Powdered activated carbon, derived from selected grades of coconut shell, is a virgin product designed for liquid phase applications. It efficiently removes organics from water streams and is certified by the NSF for use in drinking water and food-grade applications.
Product Specifications
| Mesh Size | -325 Mesh, 90% (min) |
| Iodine Number | 1100 mg/g (min) |
| pH | 8-10 |
| Ash Content | 4% (max) |
| Moisture Content | 5% (max) |
| Typical Density | 30-33 lbs/cuft, 0.48-0.53 g/cc |
Applications and Benefits:
- Removes organics from water streams.
- NSF certified for drinking water and food-grade use.
- Suitable for liquid phase purification.
- Derived from selected coconut shell grades for superior quality.
- High iodine number ensures effective performance.
Caution:
Wet activated carbon removes oxygen from the air, posing a severe hazard to workers inside carbon vessels. Follow confined space/low oxygen procedures per Local, State, and Federal guidelines before entry.
Barium Sulfate
Barium Sulfate (BaSO₄) is a chemically precipitated, high-purity compound widely used as a filler and functional additive in paints, coatings, pigments, plastics, and lead-acid batteries. Renowned for its outstanding chemical purity and narrow particle size distribution, Barium Sulfate offers excellent dispersion properties, high gloss, and low binder demand. Its extremely low chloride content and reduced electrical conductivity (100 µS/cm) make it ideal for demanding industrial applications. With an average particle size of 1.7 µm and an oil index of 13 g/100g, Barium Sulfate ensures optimal performance in various formulations. It is resistant to water, acids, alkalis, organic solvents, light, and industrial waste gases, including sulfur dioxide. Its versatility and exceptional properties make it a preferred choice for manufacturers in paints, coatings, plastics, and batteries.
Key Features
- Chemically precipitated, high-purity Barium Sulfate
- Excellent dispersion, high gloss, and low binder demand
- Extremely low chloride content and reduced electrical conductivity
- Resistant to water, acids, alkalis, and industrial gases
- Applications in paints, coatings, plastics, and batteries
Product Specifications
| Chemical Name | Barium Sulfate |
| CAS Number | 7727-43-7 |
| Chemical Formula | BaSO₄ |
| Particle Size | 1.7 µm (average) |
| Applications | Paints, coatings, plastics, pigments, batteries |
| Oil Index | 13 g/100g |
| Electric Conductivity | 100 µS/cm |
Perfect for industrial fillers and functional additives.
Boric Acid NF/USP Grade, Powder
Boric Acid, NF/USP Grade, Powder. Boric Acid (H3BO3; CAS# 10043-35-3) is a weak acid of boron commonly used as an antiseptic, insecticide, flame retardant, neutron absorber, and a precursor for other chemical compounds. Additional applications include textile fiber glass, borosilicate glass, glazes and enamels, casting powder, and flux.
Product Specifications
| Chemical Name | Boric Acid |
| Synonyms | Orthoboric Acid, OPTIBOR NF, Hydrogen Borate, Acidum Boricum |
| Molecular Formula | H3BO3 |
| CAS Number | 10043-35-3 |
| SKU | B001NF |
Applications and Benefits:
- Antiseptic and antimicrobial applications
- Flame retardant properties
- Neutron absorber in nuclear applications
- Textile fiber glass and borosilicate glass manufacturing
- Used in glazes and enamels
- Serves as casting powder and flux
Caution:
This product cannot be used as an insecticide or for carpet or upholstery deodorization or flea control. It is not intended for food applications, human nutritional supplements, or as food additives or preservatives.
Bromothymol Blue, Powder, >99%
Bromothymol Blue (also known as bromothymol sulfone phthalein, Bromthymol Blue, and BTB) is a chemical indicator for weak acids and bases. At a pH of 6.0 or lower, it appears yellow. It transitions in color between pH 6.0 and 7.6, becoming completely blue at pH 7.6.
Product Specifications
| Chemical Name | Bromothymol Blue |
| Synonyms | Bromothymol sulfone phthalein, BTB |
| Purity | >99% |
| Color Change Range | Yellow at pH ≤ 6.0, Blue at pH ≥ 7.6 |
| Chemical Formula | C27H27O5SBr2Na |
| Molecular Weight | 646.38 g/mol |
| CAS Number | 34722-90-2 |
Applications and Benefits:
- Used as a chemical indicator for weak acids and bases
- Facilitates pH measurement in the range of 6.0 to 7.6
- High purity powder for accurate scientific applications
- 1 gram prepares up to 10 liters (3 gallons) of indicator solution
Caution:
This high-purity product requires special procedures for solution preparation. For beginners, a ready-to-use solution (BTB10S) is recommended.
Bronze Powder, Spherical, Light
Prealloyed high-density spherical bronze powder is designed for specialized applications such as flame-spraying, brazing, strip bearings, metal-bonded grinding wheels, cutting tools, and metal injection molding (MIM). It is also suitable for resin-bonded friction components, decorative cold casting, surface engineering, filters, and hydraulic seals.
Product Specifications
| Chemical Composition | Copper: 89.7% Tin: 10% Phosphorous: 0.3% |
| Apparent Density | 5 g/cc |
| Particle Shape | Spherical |
| Sieve Analysis (% Weight) | +100 mesh: 0% -100/+140: 0% -140/+200: 0.1% -200/+325: 2.8% -325: 97.1% |
Applications and Benefits:
- Flame-spraying applications
- Brazing and welding materials
- Strip bearings
- Metal-bonded grinding wheels
- Cutting tools
- Metal injection molding (MIM)
- Decorative applications, including cold casting
- Resin-bonded friction components
- Surface engineering
- Filters and hydraulic seals
Caution:
Handle with care and follow safety guidelines as detailed in the SDS. Ensure suitability for the intended application before use.
Carbonyl Iron Powder (CIPMS)
CIPMS is Carbonyl Iron Powder, a zero valent iron powder in the form of microspheres with particle sizes ranging from 3 to 10 microns. Manufactured using advanced technology, it achieves an exceptional purity of 99.5% or more. This fine iron powder exhibits outstanding magnetization behavior, making it ideal for diverse applications such as metal injection molding, inductive electronic components, microwave absorption, magnetic ink, and magnetic plastic parts.
Product Specifications
| Iron (Fe) | 97.8% - 99.5% |
| Carbon (C max) | 0.75 - 0.90% |
| Nitrogen (N max) | 0.65 - 0.90% |
| Oxygen (O max) | 0.15 - 0.40% |
| d10 (Particle Size) | 1.7 - 2.7 Micron |
| d50 (Particle Size) | 3.9 - 5.2 Micron |
| d90 (Particle Size) | 7.2 - 9.2 Micron |
Applications and Benefits:
- Metal injection molding
- Inductive electronic components
- Microwave absorption materials
- Magnetic inks and plastics
- Advanced magnetization applications
Caution:
Limited quantity product. Ships only to the US lower 48 states and Canada. No COA is available for this product. Handle and use according to safety guidelines provided in the SDS.
Cast Iron Powder, Thermal Spray
Cast iron powder used in the manufacturing of specialty alloys and as an ingredient in pyrotechnic mixtures. Also suitable for thermal spray applications, with recommendations to consider S1001 and S145C for such purposes. Engineered for industrial use with high metallic iron content and controlled granulation.
Product Specifications
| Metallic Iron | >90% |
| Total Carbon | 2.85% |
| Manganese | <1.0% |
| Silicon | <3.0% |
| Chromium | <1.0% |
| Granulation | Passing 20 mesh: 95-100%, Passing 100 mesh: 1% Max. |
Applications and Benefits:
- Manufacturing of specialty alloys
- Ingredient in pyrotechnic mixtures
- Thermal spray applications
- High iron content for industrial use
- Controlled granulation for specific needs
Caution:
Evaluate product suitability before large-scale use. For thermal spray applications, also consider S1001 and S145C. Store in a dry, cool place to maintain granulation and performance.
Copper Electrode, Flat, Copper Anode, One Piece
This flat copper anode electrode offers 99.9% pure copper in a compact 19 mm × 125 mm (3/4 × 5 in) format. Stamped with “Cu” for clear identification, the one‑piece construction provides consistent electrical conductivity for a wide range of laboratory experiments. Each unit is individually packaged for convenience and protection.
Product Specifications
| Material | Copper (Cu) |
| Purity | 99.9% |
| Shape | Flat – 19mm x 125mm (3/4 x 5 inches) |
| Identification | Stamped "Cu" |
| Weight | 18g |
| Electrical Conductivity | High (consistent with 99.9% pure copper) |
| Model/Part Number | CUFLAT |
| Packaging | Individual |
Applications and Benefits:
- Science experiments and educational demonstrations
- Physics and chemistry laboratory procedures
- Electrochemical cell anodes
- Metal conductivity testing
Key Features and Benefits
- 99.9% pure copper for conductivity
- Flat form factor (19mm × 125mm) for easy handling
- Stamped “Cu” for clear material identification
- One‑piece construction eliminates seams and joints
- High electrical conductivity suitable for precise measurements
- Durable metal suitable for repeated experimental use
- Individual packaging for convenience and protection
- Weight: 18g
Caution:
Metal electrodes have sharp edges; handle with care to avoid injury.
Copper Granules, 16 Mesh (Coarse Copper Powder)
Coarse copper powder composed of high-purity metallic copper. Particles are solid, nearly uniform in size, and feature the appearance of metallic spherical crystals. Recommended for wood inlay, art projects, and industrial applications where solid round multi-sided balls are suitable. In laboratory settings, granular copper is utilized for sulfur removal from environmental samples. CAS No.: 7440-50-8.
Product Specifications
| Mesh Size | 16 |
| Material | High-purity Copper |
| Particle Shape | Spherical, metallic crystals |
| CAS Number | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial processes
- Laboratory sulfur removal from environmental samples
Caution:
Store in a dry and cool environment to maintain material integrity. Handle with appropriate protective measures to avoid direct contact. Ensure compatibility with intended applications before use.
Copper Granules, 35 Mesh (Coarse Copper Powder)
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples. Coarse 35 mesh size, with granules approximately 0.5 mm in diameter.
Product Specifications
| Mesh Size | 35 mesh |
| Granule Diameter | Approximately 0.5 mm |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Granules, Mesh 20 (Coarse Copper Powder)
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples.
Product Specifications
| Copper | 99.84% |
| Apparent Density | 5.29 g/cc |
| Sieve Analysis (Typical) | +20 mesh: 0% -20/+30 mesh: 100% -30/+40 mesh: 0.0% -40 mesh: 0.0% |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Powder 99+%, Mesh 200
High-purity copper powder made via water atomization and hydrogen reduction. Features very fine, irregular particles and clusters with relatively lower density. Recommended for applications requiring high purity and conductivity, including diamond wheels, sintering, and chemical reactions. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.3% |
| Hydrogen Loss | 0.39% |
| Apparent Density | 2.6 - 2.8 g/cc |
| Mesh Size | 200 mesh |
| Sieve Analysis |
+100 Mesh: Trace +140 Mesh: 1% Max +200 Mesh: 3% Max +325 Mesh: Balance -325 Mesh: 90% Min |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
- Diamond wheels
- Chemical reactions
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.3%, General Purpose, 150 Mesh
The most popular and widely used copper powder, produced by the water atomization method followed by hydrogen reduction. This general-purpose copper powder has diverse applications, including the production of copper compounds, use as a catalyst in chemical formulations, abrasive wheels, carbon brushes, and more. It is important to note that pure copper powders may not exhibit continuity or conductivity under low-voltage multimeter tests due to air gaps and weak particle contacts but will show conductivity under higher voltage, when compacted, or mixed with oils/resins to form a paste.
Product Specifications
| Purity | 99.3% |
| Apparent Density | 2.7 g/cc |
| Nominal Mesh | -140 |
| -325 Mesh Ratio | > 50% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Production of copper compounds
- Catalyst in chemical formulations
- Abrasive wheels
- Carbon brushes
- Electronics and electrical applications
- Decorative and protective coatings
- Brazing and general-purpose industrial use
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.3%, Mesh 325
Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.31% |
| Hydrogen Loss | 0.39% |
| Apparent Density | 2.97 g/cc |
| Mesh Size | 325 mesh |
| Sieve Analysis |
+60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.5% - 99.9%
Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.81% |
| Iron | 0.01% |
| Hydrogen Loss | 0.18% |
| Apparent Density | 4.89 g/cc |
| Sieve Analysis | +200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.8%, Electronic Grade, Mesh 325
Electronic grade, high-purity copper powder made via water atomization and hydrogen reduction. Features ultra-fine, spheroidal particles with high conductivity and low density. Recommended for a variety of applications where conductivity is crucial, including thick and thin film pastes, capacitor chips, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.85% |
| Hydrogen Loss | 0.19% |
| Apparent Density | 2.97 g/cc |
| Mesh Size | 325 mesh |
| Sieve Analysis | +60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.