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Copper Powder 99.3%, Mesh 325
Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.31% |
| Hydrogen Loss | 0.39% |
| Apparent Density | 2.97 g/cc |
| Mesh Size | 325 mesh |
| Sieve Analysis |
+60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.8%, Electronic Grade, Mesh 325
Electronic grade, high-purity copper powder made via water atomization and hydrogen reduction. Features ultra-fine, spheroidal particles with high conductivity and low density. Recommended for a variety of applications where conductivity is crucial, including thick and thin film pastes, capacitor chips, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.85% |
| Hydrogen Loss | 0.19% |
| Apparent Density | 2.97 g/cc |
| Mesh Size | 325 mesh |
| Sieve Analysis | +60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder > 99% (150 - 325 Mesh)
General-purpose, highly pure (>99%) copper powder made from electrolytic copper. Granular copper with a mesh size of 150 - 325. Known for its excellent electrical and thermal conductivities, this product finds use in the electrical and electronic industries. Additional applications include self-lubricating bearings, brazing, cold soldering, and mechanical plating. It is also used for antifouling paints, decorative and protective coatings, printing inks, medals, medallions, metal-plastic decorative products, and various chemical and medical purposes.
Product Specifications
| Purity | >99% |
| Mesh Size | 150 - 325 |
| Screen Analysis |
+60: 0.0% -60/+100: 0.7% -100/+200: 89.7% -200/+325: 9.1% -325: 0.5% |
Applications and Benefits:
- Electrical and electronic applications
- Self-lubricating bearings
- Brazing and cold soldering
- Mechanical plating
- Antifouling paints and decorative coatings
- Printing inks
- Medals, medallions, and metal-plastic decorative products
- Chemical and medical purposes
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
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