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Carbon Electrode, Flat
carbon-electrode-flat

High-purity carbon electrodes for scientific and electrical experiments.

SKU: CARBONFLAT
Copper Powder 99.3%, Mesh 325
copper-powder-993-mesh-325

Ultra-fine, high-purity copper powder with spheroidal particles.

SKU: CU301
Copper Powder 99.8%, Electronic Grade, Mesh 325
copper-powder-993-mesh-325

Electronic grade, ultra-fine, high-purity copper powder, 99.8%.

SKU: CU301E
carbon-electrode-flat
Carbon Electrode, Flat (CARBONFLAT)

Carbon Electrode, Flat

High-purity carbon electrodes for scientific and electrical experiments, also known as graphite electrodes, with electrical conductivity and thermal stability. Each electrode measures 125 x 25 x 5mm and has a smooth surface, making it safe and easy to handle during experiments. The electrodes are individually packaged and weigh 26g.


Product Specifications

Material Carbon (Graphite)
Dimensions 125 x 25 x 5mm
Weight 26g
Packaging Individual packaging

Applications and Benefits:

  • Assembling voltaic cells and electrolysis experiments
  • Electrical and electronic experiments
  • Scientific experiments requiring high-purity carbon material

Key Features and Benefits

  • High-purity carbon material
  • electrical conductivity and thermal stability
  • Individually packaged for convenience and safety

Caution:

Handle with care during experiments. Keep away from flammable materials.

SKU: CARBONFLAT
copper-powder-993-mesh-325
Copper Powder 99.3%, Mesh 325 (CU301)

Copper Powder 99.3%, Mesh 325

Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.


Product Specifications

Purity 99.31%
Hydrogen Loss 0.39%
Apparent Density 2.97 g/cc
Mesh Size 325 mesh
Sieve Analysis +60 Mesh: 0%
-60/+80 Mesh: 0%
-80/+100 Mesh: 0%
-100/+140 Mesh: Trace
-140/+200 Mesh: Trace
-200/+325 Mesh: 0.6%
-325 Mesh: 99.4%
HTS Code 7406.10.0000
NMFC 30743
CAS No. 7440-50-8

Applications and Benefits:

  • Thick and thin film pastes
  • Conductive inks, paints, and pastes
  • Injection molding
  • Thermal management
  • EDM electrodes
  • Antifouling paints
  • Thermal sprays
  • Sintered alloys/products
  • Brazing/soldering paste

Caution:

Handle with care. Refer to the SDS for detailed safety guidelines.

SKU: CU301
copper-powder-993-mesh-325
Copper Powder 99.8%, Electronic Grade, Mesh 325 (CU301E)

Copper Powder 99.8%, Electronic Grade, Mesh 325

Electronic grade, high-purity copper powder made via water atomization and hydrogen reduction. Features ultra-fine, spheroidal particles with high conductivity and low density. Recommended for a variety of applications where conductivity is crucial, including thick and thin film pastes, capacitor chips, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.


Product Specifications

Purity 99.85%
Hydrogen Loss 0.19%
Apparent Density 2.97 g/cc
Mesh Size 325 mesh
Sieve Analysis +60 Mesh: 0%
-60/+80 Mesh: 0%
-80/+100 Mesh: 0%
-100/+140 Mesh: Trace
-140/+200 Mesh: Trace
-200/+325 Mesh: 0.6%
-325 Mesh: 99.4%
HTS Code 7406.10.0000
NMFC 30743
CAS No. 7440-50-8

Applications and Benefits:

  • Thick and thin film pastes
  • Capacitor chips
  • End cap terminators
  • Conductive inks, paints, and pastes
  • Injection molding
  • Electronics
  • Thermal management
  • EDM electrodes
  • Thermal sprays
  • Sintered alloys/products
  • Brazing/soldering paste

Caution:

Handle with care. Refer to the SDS for detailed safety guidelines.

SKU: CU301E
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