Copper Powder 99.3%, Mesh 325

Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.

Product Specifications

Applications and Benefits:

• Thick and thin film pastes
• Conductive inks, paints, and pastes
• Injection molding
• Thermal management
• EDM electrodes
• Antifouling paints
• Thermal sprays
• Sintered alloys/products
• Brazing/soldering paste

Caution:

Handle with care. Refer to the SDS for detailed safety guidelines.

Copper Powder 99.5% - 99.9%

Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.

Product Specifications

Applications and Benefits:

• Thick and thin film pastes
• Capacitor chips
• End cap terminators
• Conductive inks, paints, and pastes
• Injection molding
• Electronics
• Thermal management
• EDM electrodes
• Thermal sprays
• Sintered alloys/products
• Brazing/soldering paste

Caution:

Handle with care. Refer to the SDS for detailed safety guidelines.

Dark Copper Powder 99.5% - 99.9%

Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.

Product Specifications

Applications and Benefits:

• Thick and thin film pastes
• Capacitor chips
• End cap terminators
• Conductive inks, paints, and pastes
• Injection molding
• Electronics
• Thermal management
• EDM electrodes
• Thermal sprays
• Sintered alloys/products
• Brazing/soldering paste

Caution:

Handle with care. Refer to the SDS for detailed safety guidelines.

Copper Powder 99.8%, Electronic Grade, Mesh 325

Electronic grade, high-purity copper powder made via water atomization and hydrogen reduction. Features ultra-fine, spheroidal particles with high conductivity and low density. Recommended for a variety of applications where conductivity is crucial, including thick and thin film pastes, capacitor chips, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.

Product Specifications

Applications and Benefits:

• Thick and thin film pastes
• Capacitor chips
• End cap terminators
• Conductive inks, paints, and pastes
• Injection molding
• Electronics
• Thermal management
• EDM electrodes
• Thermal sprays
• Sintered alloys/products
• Brazing/soldering paste

Caution:

Handle with care. Refer to the SDS for detailed safety guidelines.

Copper Powder CU112SP

CU112SP is a super fine, high density, high purity spherical copper powder that provides high heat conductivity and electrical conductivity properties to your products.
Our specification guarantees that at least 95% of this powder are particles smaller than 44 micron. A typical analysis however shows that 99.9% of particles are smaller than 44 micron. Most particles are between 10 micron and 22 micron.
HTS Code: 7406.10.0000.
NMFC: 30743
CAS: 7440-50-8

Applications include cold casting, 3-D printer filaments, metal clay, sintering, Green/ blue patina and rust effect, preventing mold in concrete, plaster,dry-wall, paint, adhesives and grout.
Also used in 3D printing process known as Selective Powder Deposition (SPD)
Old product code: CU155A

Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.

Safety Data Sheet for Copper Powder

Key Features

• Super fine, spherical particles
• High density and purity
• Excellent thermal and electrical conductivity
• Consistent particle size distribution
• Versatile applications in industry and art

Product Specifications

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Fluorescein (Cas 2321-07-5) For Fluorescent Dye Applications

Fluorescein is a fluorescent dye that is commonly used in various applications such as microscopy, flow cytometry, and DNA sequencing. Its chemical formula is C20H12O5 and it is also known as resorcinolphthalein. Fluorescein (Cas 2321-07-5) is a popular choice for fluorescent dye applications due to its high quantum yield and photostability. It is also water-soluble and can be easily conjugated to biomolecules, making it a versatile tool in biological research.