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Copper Powder 99.5% - 99.9%

Ultra-fine, high-purity copper powder with spherical particles.

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SKU: CU155A

Copper Powder 99.5% - 99.9%

Dark Ultra-fine, high-purity copper powder with spherical particles.

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SKU: CU155

Copper Powder 99.5% - 99.9% (CU155A)

Copper Powder 99.5% - 99.9%

Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.

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Product Specifications

Purity	99.81%
Iron	0.01%
Hydrogen Loss	0.18%
Apparent Density	4.89 g/cc
Sieve Analysis	+200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2%
HTS Code	7406.10.0000
NMFC	30743
CAS No.	7440-50-8

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Applications and Benefits:

• Thick and thin film pastes
• Capacitor chips
• End cap terminators
• Conductive inks, paints, and pastes
• Injection molding
• Electronics
• Thermal management
• EDM electrodes
• Thermal sprays
• Sintered alloys/products
• Brazing/soldering paste

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Caution:

Handle with care. Refer to the SDS for detailed safety guidelines.

View Write Review

SKU: CU155A

Copper Powder 99.5% - 99.9% (CU155)

Dark Copper Powder 99.5% - 99.9%

Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.

---

Product Specifications

Purity	99.81%
Iron	0.01%
Hydrogen Loss	0.18%
Apparent Density	4.89 g/cc
Sieve Analysis	+200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2%
HTS Code	7406.10.0000
NMFC	30743
CAS No.	7440-50-8

---

Applications and Benefits:

• Thick and thin film pastes
• Capacitor chips
• End cap terminators
• Conductive inks, paints, and pastes
• Injection molding
• Electronics
• Thermal management
• EDM electrodes
• Thermal sprays
• Sintered alloys/products
• Brazing/soldering paste

---

Caution:

Handle with care. Refer to the SDS for detailed safety guidelines.

View Write Review

SKU: CU155

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