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Copper Granules, 16 Mesh (Coarse Copper Powder)
Coarse copper powder composed of high-purity metallic copper. Particles are solid, nearly uniform in size, and feature the appearance of metallic spherical crystals. Recommended for wood inlay, art projects, and industrial applications where solid round multi-sided balls are suitable. In laboratory settings, granular copper is utilized for sulfur removal from environmental samples. CAS No.: 7440-50-8.
Product Specifications
| Mesh Size | 16 |
| Material | High-purity Copper |
| Particle Shape | Spherical, metallic crystals |
| CAS Number | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial processes
- Laboratory sulfur removal from environmental samples
Caution:
Store in a dry and cool environment to maintain material integrity. Handle with appropriate protective measures to avoid direct contact. Ensure compatibility with intended applications before use.
Copper Granules, 35 Mesh (Coarse Copper Powder)
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples. Coarse 35 mesh size, with granules approximately 0.5 mm in diameter.
Product Specifications
| Mesh Size | 35 mesh |
| Granule Diameter | Approximately 0.5 mm |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Granules, Mesh 20 (Coarse Copper Powder)
Coarse copper powder made of solid metallic high-purity copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples.
Product Specifications
| Copper | 99.84% |
| Apparent Density | 5.29 g/cc |
| Sieve Analysis (Typical) | +20 mesh: 0% -20/+30 mesh: 100% -30/+40 mesh: 0.0% -40 mesh: 0.0% |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Granules, Mesh 20 (Coarse Copper Powder)
Coarse copper powder made of solid metallic copper metal. Particles are nearly equal in size, appearing as metallic spherical crystals. Recommended for wood inlay, art, and industrial applications requiring solid round multi-side balls. Granular copper is also used in laboratories for sulfur removal from environmental samples.
Product Specifications
| Copper | 98% |
| Apparent Density | 5.29 g/cc |
| Sieve Analysis (Typical) | +20 mesh: 0% -20/+30 mesh: 100% -30/+40 mesh: 0.0% -40 mesh: 0.0% |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Wood inlay projects
- Artistic applications
- Industrial uses requiring solid multi-side balls
- Sulfur removal from environmental samples in laboratories
Caution:
Handle with appropriate safety measures. Refer to the SDS for detailed safety guidelines.
Copper Powder 99+%, Mesh 200
High-purity copper powder made via water atomization and hydrogen reduction. Features very fine, irregular particles and clusters with relatively lower density. Recommended for applications requiring high purity and conductivity, including diamond wheels, sintering, and chemical reactions. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.3% |
| Hydrogen Loss | 0.39% |
| Apparent Density | 2.6 - 2.8 g/cc |
| Mesh Size | 200 mesh |
| Sieve Analysis |
+100 Mesh: Trace +140 Mesh: 1% Max +200 Mesh: 3% Max +325 Mesh: Balance -325 Mesh: 90% Min |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
- Diamond wheels
- Chemical reactions
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.3%, General Purpose, 150 Mesh
The most popular and widely used copper powder, produced by the water atomization method followed by hydrogen reduction. This general-purpose copper powder has diverse applications, including the production of copper compounds, use as a catalyst in chemical formulations, abrasive wheels, carbon brushes, and more. It is important to note that pure copper powders may not exhibit continuity or conductivity under low-voltage multimeter tests due to air gaps and weak particle contacts but will show conductivity under higher voltage, when compacted, or mixed with oils/resins to form a paste.
Product Specifications
| Purity | 99.3% |
| Apparent Density | 2.7 g/cc |
| Nominal Mesh | -140 |
| -325 Mesh Ratio | > 50% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Production of copper compounds
- Catalyst in chemical formulations
- Abrasive wheels
- Carbon brushes
- Electronics and electrical applications
- Decorative and protective coatings
- Brazing and general-purpose industrial use
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.3%, Mesh 325
Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.31% |
| Hydrogen Loss | 0.39% |
| Apparent Density | 2.97 g/cc |
| Mesh Size | 325 mesh |
| Sieve Analysis |
+60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.5% - 99.9%
Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.81% |
| Iron | 0.01% |
| Hydrogen Loss | 0.18% |
| Apparent Density | 4.89 g/cc |
| Sieve Analysis | +200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Dark Copper Powder 99.5% - 99.9%
Ultra-fine, very high purity copper powder made via air atomization and hydrogen reduction. Features spherical particles with high conductivity and density. Recommended for diverse applications, including thick and thin film pastes, capacitor chips, end cap terminators, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.81% |
| Iron | 0.01% |
| Hydrogen Loss | 0.18% |
| Apparent Density | 4.89 g/cc |
| Sieve Analysis | +200 Mesh: 0% -200/+325 Mesh: 4.8% -325 Mesh: 95.2% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
Copper Powder 99.8%, Electronic Grade, Mesh 325
Electronic grade, high-purity copper powder made via water atomization and hydrogen reduction. Features ultra-fine, spheroidal particles with high conductivity and low density. Recommended for a variety of applications where conductivity is crucial, including thick and thin film pastes, capacitor chips, and thermal sprays. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will conduct when compacted or mixed with oils or resins.
Product Specifications
| Purity | 99.85% |
| Hydrogen Loss | 0.19% |
| Apparent Density | 2.97 g/cc |
| Mesh Size | 325 mesh |
| Sieve Analysis | +60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Capacitor chips
- End cap terminators
- Conductive inks, paints, and pastes
- Injection molding
- Electronics
- Thermal management
- EDM electrodes
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
CU264: Copper Powder, 99.5%, Mesh 100
High purity copper powder, nominal mesh 100, Apparent density: 2.6 g/cc, Copper > 99.5%, with irregular shape particles. Used in powder metallurgy. May be admixed with other metal powders and graphite for specific properties such as strength, hardness and wear resistance for structural parts.
HTS Code: 7406.10.0000
NMFC: 30743
CAS: 7440-50-8
Note: Pure copper powders do not show continuity or conductivity when tested with a multimeter. This might be due to two reasons. One reason is the low voltage used for the test. The other reason is the presence of air and weak contacts between the particles. They will exhibit conductivity with higher voltage, when compacted, and when mixed with some oil or resin to form a paste.
Safety Data Sheet for Copper Powder
Key Features
- High Purity Copper (>99.5%)
- Nominal Mesh 100 for fine granularity
- Irregular particle shape for diverse uses
- Compatible with other metals and graphite
- Conductivity with higher voltage or when compacted
Product Specifications
| Apparent Density | 2.6 g/cc |
| Purity | > 99.5% Copper |
| Particle Shape | Irregular |
| Conductivity | At higher voltages/when compacted |
| Applications | Powder Metallurgy, Alloys |
Similar Products
- High purity bronze powder, metallurgy
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- Iron powder, magnetic, for alloys
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Metallurgists, Industrial Manufacturers, Material Scientists, Engineering Students, Research and Development Labs
For MSDS ClickCU7005F Copper Powder
Copper Powder offers exceptional metallic shine, ideal for metallic inks and paints. Compatible with most resins and conductive for ink creation.
For more details, visit the CU7005F product data sheet.
Key Features
- Exceptional metallic shine
- Art-grade pigment quality
- Compatible with various resins
- Usable with drying oils like linseed
- Enables creation of conductive inks
Product Specifications
| Type | Copper Powder |
| Use | Metallic Inks, Paints |
| Compatibility | Polyurethane, Polyacrylic, Polyester |
| Conductivity | Suitable for Conductive Inks |
| Pigment Quality | Art Grade |
Similar Products
- Metallic-shine gold powder for inks
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Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Artists, Paint Manufacturers, and DIY Craft Enthusiasts
For MSDS Go to Downloads TabSafety Data Sheet for Copper Powder
CU41, Copper Powder, Mesh 40 (Coarse)
High purity atomized copper powder -40/ 100 US Mesh has the largest grains compared with our other copper powder products. It is also usually darker in color. Minimum purity: 99.0%. Typical Apparent Density: 2.4. Nominal Mesh: -40/ 100. HTS Code: 7406.10.0000. NMFC: 30743. CAS: 7440-50-8. Typical Analysis: Copper: 99.87%, Hydrogen Loss: 0.21%, Apparent Density: 2.57 g/cc. Sieve Analysis: 40 mesh 0%, -40/ 100 mesh 90.4%, -100/ 140 mesh 9%, -140 mesh 0.6%.
Key Features
- High purity, minimum 99.0%
- Coarse grain size, -40/ 100 US Mesh
- Dark color, distinct appearance
- Apparent Density: 2.57 g/cc
- Comprehensive sieve analysis included
Product Specifications
| Purity | 99.87% |
| Hydrogen Loss | 0.21% |
| Apparent Density | 2.57 g/cc |
| Mesh Size | >40 mesh 0% -40/ 100 mesh 90.4% -100/ 140 mesh 9% -140 mesh 0.6% |
| HTS Code | 7406.10.0000 |
| NMFC | 30743 |
| CAS Number | 7440-50-8 |
Similar Products
- Fine grain, 99% pure copper powder
- Medium grain, dark copper powder
- High-density, fine copper powder
- Coarse, 98% pure copper flakes
- Atomized, spherical copper granules
Note: These are similar products, and each product is different, so research is required to find the best fit for your needs.
Perfect for Industrial Manufacturers, Metal Fabrication Professionals, Chemical Industry Experts, Research and Development Teams, Specialty Alloy Producers
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